High precision, automatic alignment system for large boards

The go-to rework system for 5G, and large board applications. The Summit LXi is capable of handling boards up to 25"x47” and components as small as 01005.

Built with easy-to-use 1-2-3-GO software, operation of this rework system is simple and intuitive. Efficient convection heating provides high thermal throughput, uniformity, and a repeatable rework process. Automatic non-contact site scavenging safely removes residual solder, eliminating potential for damage to pads and solder mask. Proprietary software provides product traceability, profile analysis, and sharing of profiles between VJE systems.


Easy-To-Use Auto Profiling Software

  • User-friendly, simple thermal profile development
  • Default reflow profiles for standard rework processes
  • Advanced profile analysis software confirms successful profile development
  • Automatic reflow, remove, and replace profile created after development of Auto Profile

Simple Component-to-Site Alignment

  • Two-color LED optical alignment system allows for easy-to-see component to site alignment
  • Motorized and programmable Z and Theta axis minimizes operator intervention
  • Motorized and programmable X-Y table (option) for fully automated rework

Repeatable Thermal Performance

  • Efficient Convection Heaters provide high thermal uniformity
  • Board conditioning (preheat) is temperature based via thermocouples allowing for precise temperature measurements

Automatic Non-Contact Site Scavenging

  • Dynamic Height Sensing (DHS) Scavenger maintains consistent scavenger tip to board gap safely removing residual solder
  • Programmable X,Y, and Z axis eliminates operator intervention
  • Nitrogen capability for consistent results without post scavenge cleaning

MES Interface

  • Track all operations performed on rework system from automatic event log
  • Reflow processes easily transferred between systems

Available Tooling for Any Surface Mount Component

  • Standard nozzles for conventional components
  • Special nozzles for unique components


Technical Parameters

  • Placement Capability: 0.0010” (25u) mean + 3σ
  • Maximum Board Size: 600 x 900mm (650 x 1200mm optional)
  • Minimum Component Size: 01005
  • 80mm (3.2”) Square (90mm optional)
  • Thermocouple Jacks: 6 (14 optional)
  • Theta Motion: 360°
  • Top Heater: 2200W
  • Area Heater: 8000W (10000W optional)
  • Site Heater (optional): 1000W

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