High performance, budget-oriented rework system for medium-sized SMD assemblies

The cost-effective, high-performance solution to your rework needs. The Summit 750i is capable of handling boards up to 18"x22” and components as small as 0201.

Built with easy-to-use 1-2-3-GO software, operation of this rework system is simple and intuitive. Efficient convection heating provides high thermal throughput, uniformity, and a repeatable rework process. Proprietary software provides product traceability, profile analysis, and sharing of profiles between VJE systems.


Easy-To-Use Auto Profiling Software

  • User-friendly, simple thermal profile development
  • Default reflow profiles for standard rework processes
  • Advanced profile analysis software confirms successful profile development
  • Automatic reflow, remove, and replace profile created after development of Auto Profile Simple Component-to-Site Alignment

Simple Component-to-Site Alignment

  • Two-color LED optical alignment system allows for easy-to-see component to site alignment
  • Movable X-Y table with micrometer fine adjust for precise alignment Repeatable Thermal Performance

Repeatable Thermal Performance

  • Efficient Convection Heaters provide high thermal uniformity
  • Board conditioning (preheat) is temperature based via thermocouples allowing for precise temperature measurements

MES Interface

  • Track all operations performed on rework system from automatic event log
  • Reflow processes easily transferred between systems

Available Tooling for Any Surface Mount Component

  • Standard nozzles for conventional components
  • Special nozzles for unique components


Technical Parameters

  • Placement Capability: 0.0020” (50u) mean + 3σ
  • Maximum Board Size: 455 x 560mm (18 x 22”)
  • Minimum Component Size: 0201
  • Maximum Field of View: 50mm (2.0”) Square
  • Thermocouple Jacks: 6 (16 optional)
  • Theta Motion: 360°
  • Top Heater: 1600W
  • Area Heater: 4000W
  • Site Heater (option): 1000W

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