High precision, semi-automated system for medium to large PCB assemblies

The Leading Solution for High Volume/High Mix Applications Requiring Precision and is the Most Installed Rework System in the Electronics Manufacturing Industry.

Built with easy-to-use 1-2-3-GO software, operation of this rework system is simple and intuitive. Efficient convection heating provides high thermal throughput, uniformity, and a repeatable rework process. Automatic non-contact site scavenging safely removes residual solder, eliminating potential for damage to pads and solder mask. Proprietary software provides product traceability, profile analysis, and sharing of profiles between VJE systems.

Features

Easy-To-Use Auto Profiling Software

  • User-friendly, simple thermal profile development
    Default reflow profiles for standard rework processes
    Advanced profile analysis software confirms successful profile development
    Automatic reflow, remove, and replace profile created after development of Auto Profile

Simple Component-to-Site Alignment

  • Two-color LED optical alignment system allows for easy-to-see component to site alignment
  • Motorized and programmable Theta axis minimizes operator intervention
  • Motorized and programmable X-Y table (option) for fully automated rework

Repeatable Thermal Performance

  • Efficient Convection Heaters provide high thermal uniformity
  • Board conditioning (preheat) is temperature based via thermocouples allowing for precise temperature measurements

Automatic Non-Contact Site Scavenging

  • Dynamic Height Sensing (DHS) Scavenger maintains consistent scavenger tip to board gap safely removing residual solder
  • Programmable X,Y, and Z axis eliminates operator intervention
  • Nitrogen capability for consistent results without post scavenge cleaning

MES Interface

  • Track all operations performed on rework system from automatic event log
  • Reflow processes easily transferred between systems

Available Tooling for Any Surface Mount Component

  • Standard nozzles for conventional components
  • Special nozzles for unique components

Specifications

Technical Parameters

  • Placement Capability: 0.0005” (12u) mean + 3σ
  • Maximum Board Size: 455 x 560mm (560 x 760mm optional)
  • Minimum Component Size: 01005
  • Maximum Field of View: 65mm Square (80mm square optional)
  • Thermocouple Jacks: 6 (14 optional)
  • Theta Motion: 360°
  • Top Heater: 2.2kW
  • Area Heater: 4000W (7800W optional)
  • Site Heater (optional): 1000W

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